With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author facilitates learning about other essential topics, such as area array packages-including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, -and provides an increased understanding of the reliability failure modes of soldered SMT components. Refer to Micron customer service note CSN 34, PoP User Guide, for additional information on PoPs and warpage.
Some BGA products (for example, package-on-package PoP) require tighter warpage control than others across the reflow temperature range. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel.Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. Micron’s BGA products meet a variety of customer requirements and industry standards. In general, defects often can be attributed to causes. Successful implementation of this process depends on whether a low defect rate can be achieved. Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies.
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